Polyimide Tapes

Specs

Film thickness is 1 mil

Adhesive thickness is 1.4 mil

Total thickness is 2.4 mil

Polyimide film, Silicon Adhesive

Functionality

• Exceptional resistance to elevated temperatures.

• Ideally suited for circuit board masking and wire splicing applications.

• Operational temperature range up to 500°F (260°C).

• Constructed from polyimide film with a silicone adhesive for effortless removal.

Offers excellent high-temperature resistance and superior insulation properties. Provides residue-free surface protection, anti-static functionality, and long-lasting durability with clean, effortless removal.